CETC, an active player in the Belt and Road (B&R) Initiative
Silicon-based Analog Semiconductor Chips/Devices/Modules
CETC is a seasoned leader in China's semiconductor industry, with decades of accumulated experience in the full value chain of silicon-based analog semiconductor chips and their application products—spanning design, R&D, manufacturing, testing, and sales. Leveraging deep technical heritage and continuous innovation, CETC delivers a comprehensive portfolio that includes chips, devices, modules, total solutions, and smart terminal applications. The offerings serve a broad spectrum of high‑growth sectors, including security electronics, satellite communication and navigation, cellular and short‑range communication, energy management, industrial/automotive and consumer electronics, and intelligent power supplies. Backed by a proven track record of reliability and performance, CETC remains a trusted partner for both domestic and global customers, driving progress in analog semiconductor technology for next‑generation electronic systems.
| Security Electronics (used in various equipment platforms; high-performance, high-reliability satellite navigation terminals, satellite communication terminals, active phased array radar antennas, data-link communication terminals, etc.) | ||||||
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| High-performance frequency synthesizer chips and modules | Frequency coverage up to 30GHz, low clock jitter 36fs, low phase noise floor -236dBc/Hz, fast hopping time 100ns |
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| RF front-end chips and modules | Low switching loss 0.2dB, ultra-wideband frequency coverage 9kHz~40GHz, high withstand power 63dBm, high output power 30W
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| RF transceiver chips and modules | Frequency coverage up to 40GHz, monolithic integrated high-frequency silicon-based power amplifier 23dBm, wideband high-linearity passive mixer 3~20GHz |
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| High-performance multi-mode multi-frequency receiver chips and modules | High linearity, low noise, high isolation, high anti-interference capability |
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| Wide-temperature high-precision TCXO start-up chips | Wide temperature range -40℃~85℃, frequency stability ±0.3ppm; wide temperature range -55℃~105℃, frequency stability ±0.5ppm. Features high integration, high efficiency, large dynamic range, and wide bandwidth |
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| Satellite Communication and Navigation (used in mass-market consumer terminals such as smartphones, wearables, and connected vehicles; used in aerospace payloads such as satellite-borne communication payloads and satellite-borne GNSS receivers; used in drones, trackers, high-precision timing, displacement monitoring, etc.) | ||||||
| Short-message SoC chip | Short-message SoC chip for mass-market smartphones, high decoding sensitivity -136dBm, AEC-Q100 automotive-grade certified |
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| Short-message module | Automotive-grade module – industry’s first to achieve mass production in vehicles, industry’s smallest size (6.0×4.5×0.95mm³) BeiDou short-message SiP module
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| Voice satellite communication SoC chip | Dual-mode voice satellite communication RF-baseband integrated SoC with excellent RF performance and advanced chip architecture, compatible with both high-orbit and low-orbit satellite communication signal transmission/reception |
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| Millimeter-wave multi-channel beamforming chip | Industry-first mass-produced single-chip 32-channel Ku/K/Ka band beamforming chip |
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| Broadband low-noise amplifier | L/S band ultra-low noise figure 0.4dB, Ku/K/Ka band noise figure 1.2dB. Features high integration, high sensitivity, low spurious, and low power consumption |
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| RF front-end chips | Low switching loss 0.5dB, high isolation 56dB, low noise figure 0.6dB |
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| GNSS RF receiver chips | Integrates two RF receiver channels, local oscillator, and clock source, supporting GNSS full-system, full-frequency signal reception
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| Communication-navigation integrated RF chips | Integrates two RF receiver channels, one RF transmitter channel, local oscillator, and clock source, supporting GNSS full-system, full-frequency signal reception and regional short-message signal transmission/reception. Features low loss, high isolation, low noise, high integration |
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| Dual-frequency GNSS satellite navigation SoC chips and modules | High cost-performance, low-power dual-frequency RTK high-precision positioning, AEC-Q100 and AEC-Q104 automotive-grade certified |
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| Full-constellation full-frequency high-precision GNSS navigation SoC chips and modules | Multi-channel RF-baseband integrated on a single chip, supporting high-precision full-frequency point positioning and orientation. Features high integration, high positioning accuracy, low power consumption |
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| Cellular and Short-Range Communication (used in 4G/5G/5.5G cellular communication base stations, etc.; used in small quadcopter drones, remote-control toys, smart home, white goods, etc.) | ||||||
| RF switches | Full-series RFSOI RF switches, frequency DC-40GHz, high isolation 80dB
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| Low-noise amplifiers | High linearity OIP3 42dBm, low noise figure 0.5dB |
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| RF front-end modules | Dual-channel multi-chip SiP multi-functional integration |
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| Frequency synthesizer chips | Frequency coverage up to 20GHz, low phase noise -235dBc/Hz, currently the only domestic supplier. Features high performance, small size, high linearity, wide operating frequency, low phase noise |
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| 2.4GHz GFSK short-range communication chip | High receive sensitivity -89dBm@1Mbps, high output power 9dBm. |
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| Energy Management (used for solar PV cell hot-spot protection; used in base stations, terminals, industrial control, fast-charging power adapters, etc.; used in handheld internal resistance/voltage test instruments, battery monitoring, digital energy storage, etc.) | ||||||
| Photovoltaic bypass switch circuits/modules | Low forward average on-voltage, low heat generation, low reverse leakage, high reliability
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| High-efficiency micro-power module series | 4-channel 14V4A, 2-channel 16V13A, 2-channel 14V50A step-down micro-power modules and 40V5A buck-boost products, conversion efficiency better than competitors |
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| Ultra-low noise series linear regulators | 20V1.5A 5µV-RMS, 16V0.8A 1.8µV-RMS low-noise LDOs |
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| Internal resistance measurement SoC chips and modules | First domestic mass-produced internal resistance measurement SoC chips and modules, high detection accuracy ±0.2mΩ |
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| Industrial/Automotive and Consumer Electronics (used in relay driving, LED driving, mirror adjustment, body control, and other automotive applications; used in digital set-top boxes, routers, and other communication equipment) | ||||||
| Multi-channel half-bridge driver series; High-side/low-side driver series; LED drivers | Features small size, high reliability, high integration, high precision. Core chips AEC-Q100 automotive-grade certified, modules AEC-Q104 automotive-grade certified
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| Network communication power modules | Operating ambient temperature 40℃, surge 4KV and above, energy efficiency Level VI. Meets industry requirements for high reliability, long-term stable operation, and provides protection against surge, lightning, and EMC, ensuring uninterrupted operation of network communication products. |
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| Intelligent Power Supplies (used in mobile phones, laptops, drones, AI device power supplies, etc.) | ||||||
| PD fast chargers | Small size, high power density: ≥1.0W/cm³; Protocols: PD, PPS, QC2.0, QC3.0, 30W, Apple 2.4A, Samsung 2A, DCP 1.5A, AFC, FCP, HVSCP 10V/2.25A, etc. Compatible with industry standards and most private protocols, enabling stable fast charging.
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